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Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
Brand Name:
Bergquist
MFR Code:
MFR Code::
HF625-0.005-AC-104
| Dimensions |
: |
25 x 19mm |
| Thickness |
: |
0.127mm |
| Length |
: |
25mm |
| Width |
: |
19mm |
| Thermal Conductivity |
: |
0.5W/m·K |
| Material |
: |
Hi-Flow 625 |
| Self-Adhesive |
: |
Yes |
| Minimum Operating Temperature |
: |
-30°C |
| Maximum Operating Temperature |
: |
+150°C |
| Material Trade Name |
: |
Hi-Flow 625 |
| Operating Temperature Range |
: |
-30 → +150 °C |
