Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
Brand Name:
Bergquist
MFR Code::
HF625-0.005-AC-104
| Dimensions | : | 25 x 19mm |
| Thickness | : | 0.127mm |
| Length | : | 25mm |
| Width | : | 19mm |
| Thermal Conductivity | : | 0.5W/m·K |
| Material | : | Hi-Flow 625 |
| Self-Adhesive | : | Yes |
| Minimum Operating Temperature | : | -30°C |
| Maximum Operating Temperature | : | +150°C |
| Material Trade Name | : | Hi-Flow 625 |
| Operating Temperature Range | : | -30 → +150 °C |