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Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Brand Name:
Bergquist
MFR Code:
MFR Code::
HF650P-0.001-01-00-122
| Thickness |
: |
0.001in |
| Thermal Conductivity |
: |
1.5W/m·K |
| Material |
: |
Hi-Flow 650P |
| Self-Adhesive |
: |
Yes |
| Minimum Operating Temperature |
: |
-40°C |
| Maximum Operating Temperature |
: |
+150°C |
| Material Trade Name |
: |
Hi-Flow 650P |
| Operating Temperature Range |
: |
-40 → +150 °C |
