Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Brand Name:
Bergquist
MFR Code::
HF650P-0.001-01-00-122
| Thickness | : | 0.001in |
| Thermal Conductivity | : | 1.5W/m·K |
| Material | : | Hi-Flow 650P |
| Self-Adhesive | : | Yes |
| Minimum Operating Temperature | : | -40°C |
| Maximum Operating Temperature | : | +150°C |
| Material Trade Name | : | Hi-Flow 650P |
| Operating Temperature Range | : | -40 → +150 °C |