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ITW Devcon Solid Adhesive, 500 g
Brand Name:
ITW Devcon
MFR Code:
MFR Code::
691-189
Adhesive Type |
: |
Epoxy Adhesive |
Application |
: |
Industrial |
Material Compatibility |
: |
Stainless Steel |
Colour |
: |
Grey |
Product Form |
: |
Solid |
Package Type |
: |
Can |
Package Size |
: |
500 g |
Cure Time |
: |
16 h |
Shear Strength |
: |
16 MPa |
Maximum Operating Temperature |
: |
+121°C |
Specific Gravity |
: |
2.24 |
Operating Temperature Range |
: |
→ +121 °C |
Setting Time |
: |
58min |