ITW Devcon Solid Adhesive, 500 g
Brand Name:
ITW Devcon
MFR Code::
691-189
Adhesive Type | : | Epoxy Adhesive |
Application | : | Industrial |
Material Compatibility | : | Stainless Steel |
Colour | : | Grey |
Product Form | : | Solid |
Package Type | : | Can |
Package Size | : | 500 g |
Cure Time | : | 16 h |
Shear Strength | : | 16 MPa |
Maximum Operating Temperature | : | +121°C |
Specific Gravity | : | 2.24 |
Operating Temperature Range | : | → +121 °C |
Setting Time | : | 58min |