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Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 25.4 x 19mm
Brand Name:
Bergquist
MFR Code:
MFR Code::
SPK4-0.006-00-104
| Dimensions |
: |
25.4 x 19mm |
| Thickness |
: |
0.152mm |
| Length |
: |
25.4mm |
| Width |
: |
19mm |
| Thermal Conductivity |
: |
0.9W/m·K |
| Material |
: |
Thin Film Polyimide |
| Minimum Operating Temperature |
: |
-60°C |
| Maximum Operating Temperature |
: |
+180°C |
| Hardness |
: |
Shore A 90 |
| Material Trade Name |
: |
Sil-Pad K4 |
| Operating Temperature Range |
: |
-60 → +180 °C |
