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Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 11.1 x 7.92mm
Brand Name:
Bergquist
MFR Code:
MFR Code::
SPK10-0.006-AC-50
| Dimensions |
: |
11.1 x 7.92mm |
| Thickness |
: |
0.152mm |
| Length |
: |
11.1mm |
| Width |
: |
7.92mm |
| Thermal Conductivity |
: |
1.3W/m·K |
| Material |
: |
Thin Film Polyimide |
| Self-Adhesive |
: |
Yes |
| Minimum Operating Temperature |
: |
-60°C |
| Maximum Operating Temperature |
: |
+180°C |
| Hardness |
: |
Shore A 90 |
| Material Trade Name |
: |
Sil-Pad K10 |
| Operating Temperature Range |
: |
-60 → +180 °C |
