Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 28.96 x 20.57mm
Brand Name:
Bergquist
MFR Code::
SPK4-0.006-AC-122
| Dimensions | : | 28.96 x 20.57mm |
| Thickness | : | 0.152mm |
| Length | : | 28.96mm |
| Width | : | 20.57mm |
| Thermal Conductivity | : | 0.9W/m·K |
| Material | : | Thin Film Polyimide |
| Self-Adhesive | : | Yes |
| Minimum Operating Temperature | : | -60°C |
| Maximum Operating Temperature | : | +180°C |
| Hardness | : | Shore A 90 |
| Material Trade Name | : | Sil-Pad K4 |
| Operating Temperature Range | : | -60 → +180 °C |